NEXTECK NEWS

Nexteck provide a complete range of Silicon Nitride (Si₃N₄) materials, including ceramic powder and ceramic substrate...

 Comprehensive Si₃N₄ Solutions

Nexteck Technology has long been committed to following the development of advanced materials and manufacturing technolog...

 CERAMIC JAPAN – Industry Insight

As the semiconductor industry continues to thrive, Nexteck Singapore Pte Ltd is excited to announce a significant increas...

 Expanding Capacity As Global Semiconductor Sales Soar

NEXTECK will take part in 2025 Semicon Taiwan Discover cutting-edge solutions that can reduce your production costs by up...

 NEXTECK will take part in 2025 Semicon Taiwan

The secret behind the AI brain is not a single monolithic chip, but rather a team of chiplets working together! From chip...

 How Does Chiplet Packaging Build an AI Brain?

In semiconductor manufacturing, wafer dicing is a crucial step where processed wafers are cut into individual chips. To p...

 UV Film vs. Blue Film: What's the Difference in Wafer Dicing

AI・Chiplet・Sustainability Ushering a New Era of Semiconductor Manufacturing Though not exhibiting this year, Nexteck ...

 Focus on SEMICON Southeast Asia 2025

At Nexteck, we stay closely tuned to cutting-edge semiconductor advancements. The 70th IEEE IEDM (International Electron ...

 Advanced Technology Insight | Highlights from IEEE IEDM

Nexteck appreciates your support over the past year...

 Happy Lunar New Year

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