Comprehensive Si₃N₄ Solutions


Nexteck provide a complete range of Silicon Nitride (Si₃N₄) materials, including ceramic powder and ceramic substrates/blanks, designed for automotive power modules, advanced packaging, and high-reliability thermal insulation applications.
 
Si₃N₄ Powder
  Formulated for DBC/AMB ceramic substrates and vacuum-sintered ceramics, featuring:
  High thermal conductivity, ideal for automotive thermal management
  High strength and toughness for excellent reliability under thermal cycling and vibration
  Controlled particle size and high purity for stable sintering and predictable ceramic performance
  Suitable for developing high-performance and high-reliability ceramic components.
 
Si₃N₄ Ceramic Substrates / Blanks
  Engineered with outstanding thermal-shock resistance and electrical insulation, making them the preferred material for automotive power module baseplates:
  Compatible with IGBT, SiC, MOSFET power modules
  High temperature and crack-resistance, extending module lifetime
  High insulation resistance & dielectric strength, optimized for DBC/AMB processes
  Balanced thermal conductivity and mechanical strength to ensure stable operation of EV inverters
  Perfect for DBC/AMB substrate structures and high-reliability thermal insulation interfaces.
 
Complete Supply & Technical Support
  By supplying both Si₃N₄ powder and Si₃N₄ ceramic substrates, we support customers with material selection, formulation guidance, and application-specific recommendations to meet performance and reliability targets.
nexteck
Feel free to contact us for samples, specifications, or technical consultation.

Our Products

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Cover Tape

HS4DWG , HSNGW, HSABT, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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