Focus on SEMICON Southeast Asia 2025-cover tape|carrier tapes|NEXTECK

Focus on SEMICON Southeast Asia 2025

AI・Chiplet・Sustainability — Ushering a New Era of Semiconductor Manufacturing

Though not exhibiting this year, Nexteck continues to support the semiconductor community with high-performance Cover Tape and UV Dicing Tape designed for precision packaging and wafer processing.

Our materials are widely used in ICs, MEMS, power devices, and optoelectronics, helping customers achieve higher stability and yield.

✔ Cover Tape for high-speed automation

✔ UV Dicing Tape with excellent thermal resistance and stable adhesion

Visit our website to explore more about our advanced material solutions.

Learn more: www.nexteck.com.sg

Nexteck — Empowering the future of semiconductor packaging materials

Our Products

Cover Tape

HS4DWG , HSNGW, HSABT, Highly transparency

Thermo film

Cover tape film with excellent sealing performance

DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding