How Does Chiplet Packaging Build an AI Brain?
The secret behind the AI brain is not a single monolithic chip, but rather a team of “chiplets” working together!
From chiplets to 3D packaging, a miniature building block revolution is quietly reshaping how we think about computing power. Industry giants like TSMC, Intel, and NVIDIA are all fully committed, making chiplet packaging a key technology in constructing the AI brain.
In the era of rapid artificial intelligence (AI) growth—powering everything from smart speakers and autonomous vehicles to medical diagnostics and language models—the “brain” at the core of it all is no longer a massive standalone chip. Instead, it’s a complex system assembled from numerous tiny chips, called chiplets.
This technology not only dramatically enhances performance and flexibility, but also resembles LEGO blocks, enabling hardware to become modular, much like software.
As this chiplet-led revolution reshapes the semiconductor industry, reliable materials and advanced solutions are essential to support packaging and integration.
Nexteck is committed to providing high-quality materials that contribute to the performance and efficiency of these cutting-edge technologies.
