NEXTECK SINGAPORE PTE LTD
ELEGRIP TAPE
COVER TAPE
Nexteck offers a comprehensive range of UV dicing tapes, engineered to deliver high yield, process stability, and excellent die handling. Ideal for wafer dicing, die pick-up, high-temperature processes, and ESD-sensitive environments.
• Suppresses backside chipping and die fly-out for better yield
• Strong adhesion and flexibility, works well on tough surfaces like EMC
• Stable over time for long-term storage and multi-step processing
• High elongation for easy die pick-up and handling
• High-temperature UV type available, withstanding up to 200°C
• Antistatic options for ESD-sensitive applications
• Available in clear, milky white, and light blue for easy identification
• Silicon(Si) gallium arsenide (GaAS) and other types of semiconductors
• Package substrate (BGA/QFN etc)
• Glass, Crystal
• UV Series
• Non-UV Series
• For middle-bumped wafers & detaping back grrinding tape
• BG Series
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A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components.With greater diversity and higher quality in chips, dicing tapes also require advanced technology.Dicing tapes of NEXTECK are widely used in a variety of applications including slicing , single EMC encapsulation substrate , drive IC , LTCC substrate , silicon chip , ceramics , glass, and optical lens .UV series dicing types have ultra high crystallized ability by adhesion and ultraviolet irradiation , easy to be peeled , without remains and anti-static. We provide whole roll as well as customized shapes.
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