NEXTECK NEWS

AI is driving integrated semiconductor supply chains, while advanced packaging increases demand for stable, high-performance wafer dicing tape solutions...

AI Drives Advanced Packaging Growth and Dicing Tape Demand

Advanced packaging and wafer-level processing are reshaping semiconductor supply chains, creating new demand for reliable, high-performance packaging materials...

Packing Market Surges as Advanced Wafer Tech Reshapes Global Supply Chains

Imec has launched a new research program focused on 300mm gallium nitride (GaN) technology to support the development of ...

 Imec Launches 300mm GaN Program for Next-Generation Power De

Thank you for your continued trust and support throughout the year. We look forward to advancing ceramic material solutio...

 Merry Christmas from Nexteck

SEMICON Japan is a leading global platform that brings together the semiconductor manufacturing supply chain, showcasing ...

 SEMICON Japan 2025 | The Premier Semiconductor Industry Even

Nexteck Technology has long been committed to following the development of advanced materials and manufacturing technolog...

 CERAMIC JAPAN – Industry Insight

As the semiconductor industry continues to thrive, Nexteck Singapore Pte Ltd is excited to announce a significant increas...

 Expanding Capacity As Global Semiconductor Sales Soar

AI・Chiplet・Sustainability Ushering a New Era of Semiconductor Manufacturing Though not exhibiting this year, Nexteck ...

 Focus on SEMICON Southeast Asia 2025

Nexteck appreciates your support over the past year...

 Happy Lunar New Year

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