NEXTECK SINGAPORE PTE LTD
ELEGRIP TAPE
COVER TAPE
Cover tape for carrying thermo forming electron with superior applicability.
Cover tape classification:
Heat-seal type
Pressure sensitive type
Application
Electric parts and semiconductor carrying
Product Features
Stable surface strength , easy to be set bending conditions.
Favorable usability for variety carrier tape materials (PS，PC，PET，PVC)
AT,ATA specifications: high transparency ,strong visibility,outstanding cost performance
ATA specification: More suitable for anti-static packaging for small parts due to the slight frictional electrification of epoxy packaging.
| Item | Unit | ALS-WG4 | ALS-WG5 | ALS-TB300ASH |
| Thickness | μm | 46±5 | 46±5 | 0.052 |
| Tensile breaking strength | MPa | 81±27 | 81±27 | 60 |
| Total light transmittance | % | 88±2 | 90±2 | 88±2 |
| Haze | % | 21±11 | 21±11 | 18 |
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Sheet resistivity PET side Sealant side |
Ω/sq. |
109-12 107-10 |
109-12
109-10 |
1010
108 |
|
Static decay time
+ charge ‐charge |
sec. |
0.01 0.01 |
0.03 0.03 |
0.01 0.01 |
| Apply to | PS，PC，PVC，PET | |||
| Evaluation Unit | DKK THERMO SHEEL EC | CST-2401 | |||
| （ Electrical conductivity） | （No electrical conductivity） | ||||
| EC-R | EC-M3 | EC-TP2 | CST-2401 | ||
| electric conduction PS standard |
High strength and low pollution |
Super high strength and ultra-low pollution |
Transparnet and easy forming property |
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Anti electric treatment |
ALS-AS anti electric standard |
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ALS-ATA high transparency low static |
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Without anti electric treatment |
ALS-S standard ( not anti electricity ) |
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ALS-AT high transparency ( not anti electricity） |
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Note: The value recorded is an example of measured value rather than guarantee value. Please make trial and ensure the compatibility and safety of the products before formal usage.
A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components.With greater diversity and higher quality in chips, dicing tapes also require advanced technology.Dicing tapes of NEXTECK are widely used in a variety of applications including slicing , single EMC encapsulation substrate , drive IC , LTCC substrate , silicon chip , ceramics , glass, and optical lens .UV series dicing types have ultra high crystallized ability by adhesion and ultraviolet irradiation , easy to be peeled , without remains and anti-static. We provide whole roll as well as customized shapes.
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