Cover Tape

nexteck.com

 

Cover tape for  carrying thermo forming electron with superior applicability.

Cover tape classification: 

Heat-seal type  

Pressure sensitive type

nexteck.com

Application

Electric parts and semiconductor carrying

 

Product Features

  • Stable surface strength , easy to be set bending conditions.

  • Favorable usability for variety carrier tape materials (PS,PC,PET,PVC)

  • AT,ATA specifications: high transparency ,strong visibility,outstanding cost performance

  • ATA specification:  More suitable for anti-static packaging for small parts due to  the  slight frictional electrification of epoxy packaging.

Item Unit ALS-WG4 ALS-WG5 ALS-TB300ASH
Thickness μm 46±5 46±5 0.052
Tensile breaking strength MPa 81±27 81±27 60
Total light transmittance % 88±2 90±2 88±2
Haze % 21±11 21±11 18

Sheet resistivity

PET side

Sealant side

Ω/sq.

109-12

107-10

109-12

 

109-10

1010

 

108

Static decay time

 

+ charge

‐charge

sec.

0.01

0.01

0.03

0.03

0.01

0.01

Apply to   PS,PC,PVC,PET

 

Evaluation Unit DKK THERMO SHEEL EC CST-2401
( Electrical conductivity) (No electrical conductivity)
EC-R EC-M3 EC-TP2 CST-2401
electric conduction PS standard High strength and
 low pollution
Super high strength and
 ultra-low pollution
Transparnet and 
easy forming property
Anti electric
treatment
ALS-AS 
anti electric standard

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nexteck.com

nexteck.com

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ALS-ATA  
high transparency
low static

nexteck.com

nexteck.com

nexteck.com

nexteck.com

Without anti electric 
treatment
ALS-S standard
( not anti electricity )

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nexteck.com

nexteck.com

nexteck.com

ALS-AT 
high transparency
( not anti electricity)

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nexteck.com

nexteck.com

nexteck.com

Note: The value recorded is an example of measured value rather than guarantee value. Please make trial and ensure the compatibility and safety of the products before formal usage.

Dicing Tape - UV Series

A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components.With greater diversity and higher quality in chips, dicing tapes also require advanced technology.Dicing tapes of NEXTECK are widely used in a variety of applications including slicing , single EMC encapsulation substrate , drive IC , LTCC substrate , silicon chip , ceramics , glass, and optical lens .UV series dicing types have ultra high crystallized ability by adhesion and ultraviolet irradiation , easy to be peeled , without remains and anti-static. We provide whole roll as well as customized shapes.

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