WLCSP

Wafer Level Chip Scale Packaging (WLCSP), is a method of the wafer packaging.
Opposite with the traditional packaging method-package testing after dicing which increases at least 20% of the chip volume after packaging; WLCSP packs and tests the whole wafer first, and cuts them into each IC dies, thus, the final size of the chip is the same as the original IC wafer.
Applications

 
· Bluetooth/Wi-Fi
· GPS
· FM Radio
· Camera
· Cell Phones and System Boards
· Analog Devices
· Power Amplifier
· Power supply
· RF Devices
· Mini LED
· Tiny component
· Optoelectronic device

Features:
The material of product is a PC carrier tape.
1. Static dissipation, which protects static sensitive components.
2. The material will not break when bent.
3. Small burrs (<20μm), High precision.
4. Size stability.

WLCSP

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Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo Film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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