APPLICATION-DICING TAPE

Overview

Pressure-sensitive adhesive type is used while dicing various types of wafers. We provide the best possible tapes to meet your ever diversify range of needs. UV type is used while dicing a wide range of workpieces, including various types of wafers, package substrates, ceramics, glass and crystal. For the ease of peeling, UV dicing tape is exposed to UV light, thereby weakening its adhesive strength

Features

  • Superior storage time stability
  • Two available colors: milky white and light blue
  • Anti-static types are also available (optional)

Product Number

  • F-90MW / T-80HW

Dicing Tape (UV Type)

Overview

Pressure-sensitive adhesive type is used while dicing various types of wafers. We provide the best possible tapes to meet your ever diversify range of needs. UV type is used while dicing a wide range of workpieces, including various types of wafers, package substrates, ceramics, glass and crystal. For the ease of peeling, UV dicing tape is exposed to UV light, thereby weakening its adhesive strength

Features

  • Wide range of items available with different adhesive thickness
  • Prevent from die-fly and chipping (cacking) on the backside surface
  • Easy pickup (easy to peel)
  • Exhibts surperior adhesive qualities for workpieces that are incredibly anti-adhesive, such as those made from EMC (epoxy molding compounds)
  • Anti-static types are available (optional)

Product Number

  • UDV-80J / UDV-100J / UHP-0805MC / UHP-110AT / UHP-100B UHP-110BZ / UHP-110M3 / UHP-1025BZ / UDT-100M3 UDT-1005M3 / UDT-1025M3 / UDT-1025MC / UDT-1025SG UDT-1915MC
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Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo Film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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