Research and development spending by semiconductor companies worldwide is forecast to grow 4% in 2021 to USD 71.4 billion after raising 5% in 2020 to record high of USD 68 .4 billion, is according to “IC Insights”.
The above R&D Investment and Strength in 4% is far from enough to be Good in this demanding industry, especially in developing new and advanced materials to meet with the rapidly changing technical development. For sure, those choose to stay comfortability under evening sunset will be expelled.
Nexteck Singapore Pte Ltd and our Japan Partners has stay firm in R&D in packing materials like precision Cover tape and WLCSP Cover tapes sheets materials.
Our R&D team has successfully enhanced and our current ALS-NCG Cover tape films of which the steadiness in peeling force is higher than the market tough technical demand.
Nexteck Group has initially supported this ALS-NCG (new version) Cover tape materials to all current Key Customers. We will also provide sample to interesting customers or end users. Please feel free to contact us at firstname.lastname@example.org for further information or technical support.
“Your Success, Our Mission” is the motto of Nexteck Singapore Pte Ltd.