The difference between Interfacial peeling and Adhesive layer peeling. Super Capability and studies on the design of Peel...

SEASONS GREETINGS Nothing beats the cold (COVID) like a company of good partners and friends! Thank you for all your kind...

The RD team of Nexteck Singapore Pte Ltd, has much effort in taking the advantage and avoiding the disadvantage of Square...

Dicing tapeis a backing tape used during wafer dicing , the cutting apart of pieces of semiconductor material following w...

Innovative solutions to help improve productivity in the age of electronic components Advancement of wafer level packagin...

Nexteck Group majored in Semiconductors packing materials of Reel and tape, support the sloganLeading the Smart Future of...

In Semiconductor and Packing Materials industries, like WLCSP class precision carrier tape and cover tape manufacturer, N...

National Day 2020 will be a unique one in many ways. In the midst of a pandemic, we still have many reasons to celebrate ...

Embossed carrier tape is used for packing various tiny wafers, chips electronic components used in cell phones and precis...