NEXTECK SINGAPORE PTE LTD
ELEGRIP TAPE
COVER TAPE
Nexteck Boron Nitride Shapes is a machining shaped ceramics product with many of the following superior properties.
Feel free to consult us about any physical property or processing form requested.
-High temperature (max. temp oxidizing/inert 950C/2,200'C)
-Good lubricating properties.
-Good machine ability.
-High electrical resistivity even in high temperature.
-Chemical inertness it can be used in HCL, NHs gas atmosphere in high temperature.
Ceramics Shapes Al–SiC Metal Matrix Composite Ceramic Substrate Power Module Substrate Thermal Management Substrate Metal Matrix Composite Baseplate (MMC) DBC (Direct Bonded Copper) Substrate Power Semiconductor IGBT Module SiC Power Devices
A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components.With greater diversity and higher quality in chips, dicing tapes also require advanced technology.Dicing tapes of NEXTECK are widely used in a variety of applications including slicing , single EMC encapsulation substrate , drive IC , LTCC substrate , silicon chip , ceramics , glass, and optical lens .UV series dicing types have ultra high crystallized ability by adhesion and ultraviolet irradiation , easy to be peeled , without remains and anti-static. We provide whole roll as well as customized shapes.
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