IoT/IIoT, 5G/6G & AI Chips Packing Solution

Chips Packing Solution

The race for the most advanced semiconductors can only be won with technological and industrial leadership. Alongside the traditional mass business, the main drivers are high-tech applications such as Autonomous Driving, Edge Computing, IoT/IIoT, 5G/6G and Artificial Intelligence.

With increased demand, the need for innovative packaging solutions is rapidly growing. The EU has responded and is promoting the expansion of corresponding infrastructures in Europe with the European Chips Act. We will also find the latest information on all facets of semiconductor packaging in SEA.

HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (40 mm x 40 mm) and substantial package body sizes (100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.

New capillary underfill formulation that meets the dimensional demands of highly integrated package designs. The material’s low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage.

The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore’s Law. Citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages.

These are also challenge for Nexteck Singapore Pte Ltd., WLCSP carrier tape and cover tape, RD development and production team. Customers in SEA is pushing for our New packing materials solution to meet with their cutting-edge products.

Our Products


Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency


Thermo film

Cover tape film with excellent sealing performance



Dicing Tape,fixing semicon, silicon, GaAs during dicing



Back Grinding Tape,protect circuit surface during back grinding


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