Dicing Tape

Material Outline

Nexteck offers a comprehensive range of UV dicing tapes, engineered to deliver high yield, process stability, and excellent die handling. Ideal for wafer dicing, die pick-up, high-temperature processes, and ESD-sensitive environments.

Key Features:

• Suppresses backside chipping and die fly-out for better yield
• Strong adhesion and flexibility, works well on tough surfaces like EMC
• Stable over time for long-term storage and multi-step processing
• High elongation for easy die pick-up and handling
• High-temperature UV type available, withstanding up to 200°C
• Antistatic options for ESD-sensitive applications
• Available in clear, milky white, and light blue for easy identification

Recommended Workpieces:

• Silicon(Si) gallium arsenide (GaAS) and other types of semiconductors
• Package substrate (BGA/QFN etc)
• Glass, Crystal
• UV Series
• Non-UV Series

Back Grinding Tape

Recommended Applications：

• For middle-bumped wafers & detaping back grrinding tape
• BG Series


Read More