NEXTECK NEWS

Looking for enhanced traceability for your products in carrier tape? Nextecks carrier tape comes equipped with high-quali...

 Custom 2D Code Laser

Advanced semiconductor packaging combines multiple chips into a single compact unit, offering significant benefits. It in...

 Next Generation IC Packaging

The packaging plan established by Nexteck defines the packaging requirements both inside and outside the EPA according to...

 Nexteck Customized Packaging Complies with ANSI/ESD S541

Washington November 5, 2024 The Semiconductor Industry Association (SIA) today reported that global semiconductor sales t...

 Global Semiconductor Sales Reach Record High in September

SEMICON Taiwan 2024 has held exhibitions from September 4th to September 6th at Hall 1 and Hall 2 of Taipei Nangang Exhib...

 SEMICON Taiwan 2024

NEXTECK will take part in 2024 Semicon Taiwan Discover cutting-edge solutions that can reduce your production costs by up...

 NEXTECK will take part in 2024 Semicon Taiwan

The infamously cyclical semiconductor industry had a challenging year in 2023, with sales expected to be down 9.4% (to US...

 Chip Packaging & Packing Bounce in 2024 Q1

The race for the most advanced semiconductors can only be won with technological and industrial leadership. Alongside the...

 IoT/IIoT, 5G/6G & AI Chips Packing Solution

WASHINGTONMarch 4, 2024The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales t...

 Global Semicon Sales Up 15.2% Annually in January 2024

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