NEXTECK NEWS

AI・Chiplet・Sustainability Ushering a New Era of Semiconductor Manufacturing Though not exhibiting this year, Nexteck ...

 Focus on SEMICON Southeast Asia 2025

At Nexteck, we stay closely tuned to cutting-edge semiconductor advancements. The 70th IEEE IEDM (International Electron ...

 Advanced Technology Insight | Highlights from IEEE IEDM

Nexteck appreciates your support over the past year...

 Happy Lunar New Year

WASHINGTON—Jan. 17, 2025—The Semiconductor Industry Association (SIA) issued the following statement from SIA Preside...

 CHIPS Act Incentives from the U.S. Department of Commerce

NEXTECKhasactivelyparticipatedinNEPCONJAPAN,whichhasevolvedalongsidethegrowthoftheelectronicsindustryinJapanandAsia.Theev...

 NEPCON JAPAN - January 22-24, 2025 at Tokyo

As the holiday season arrives, we would like to express our gratitude for your support this year. Wishing you and your lo...

 Merry Christmas from NEXTECK!

Looking for enhanced traceability for your products in carrier tape? Nextecks carrier tape comes equipped with high-quali...

 Custom 2D Code Laser

Advanced semiconductor packaging combines multiple chips into a single compact unit, offering significant benefits. It in...

 Next Generation IC Packaging

The packaging plan established by Nexteck defines the packaging requirements both inside and outside the EPA according to...

 Nexteck Customized Packaging Complies with ANSI/ESD S541

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