NEXTECK WLCSP Carrier Tape Raised & Depressed Cross Bar
If Chip Size < 1x1mm, Raised Cross Bar Design to be used
For “ Raised Cross Bar Design “, K0=A+0.100, K1=K0+0.03 ( Raised Cross Bar ), it would have enough gap to placing the device during taping process and would also avoid the tilt device & sticking device phenomenon after Cover Tape Sealing in Nexteck Singapore Pte Ltd.
This Tooling would be more precise than others so that the unit cost would also be more higher than others. But precision is the core value of Nexteck Group.
If Chip Size >1x1mm, Depressed Cross Bar Design to be used
For “ Depressed Cross Bar Design “, K0=A+0.155, K1=K0-0.03 ( Depressed Cross Bar ), it would have enough gap to placing the device during taping process and would also avoid the tilt device & sticking device phenomenon after Cover Tape Sealing under the production rule of www.nexteck.com.sg.